IDT to Showcase Live Demo of 200G PAM4 ICs for Datacenter Applications at ECOC 2017

San Jose, California, September 17, 2017 /– Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced a live demonstration of its latest 200G VCSEL and DML Drivers, and TIA ICs at ECOC 2017. This newest family of 2- and 4-channel PAM4 CDR/Retimers, 1x and 4x VCSEL and DML Drivers, and TIAs will help address current datacenter challenges, enabling IDT’s customers to upgrade hyper-scale datacenter and cloud computing infrastructure from 100G to 200G and beyond.

In recent years, hyper-scale datacenters have pushed the boundaries of network design to support the highly virtualized and scaled-out applications of the modern age. As cloud and networking services become increasingly central to consumers’ lives, IDT’s latest solutions help datacenter operators to meet the continuously growing demands for higher densities and greater speeds brought on by the overwhelming increase in data traffic. It is essential that they are able to quickly and easily transition to higher data rates as needed in order to meet business requirements.

“Datacenters are facing enormous pressure to keep the pace, supporting the higher bandwidths required to deliver an exceptional experience for their customers. IDT’s latest family of 50G/200G, PAM4 CDR/Retimers, VCSEL and DML Drivers and TIAs will make it possible for datacenter operators to upgrade their servers from 100G to 200G and beyond, delivering the data rates necessary for emerging applications – such as live video streaming, AI chatbots, augmented and virtual reality – that demand a new level of performance from cloud infrastructure,” said Dr. Raluca Dinu, VP/GM of the Optical Interconnect Division at IDT, Inc. “We are very excited to be the first company to begin sampling 2- and 4-channel analog 200G PAM4 Clock Data Recover/Retimers based on advanced CMOS technology to our customers.”

Samsung Selects IDT Wireless Power for Galaxy Note8

San Jose, California, September 13, 2017 /– Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced that IDT and Samsung have again collaborated to deliver fast wireless charging for Samsung’s next-level Note device, the new Galaxy Note8, featuring Samsung’s most advanced wireless charging capabilities to date.

Samsung and IDT continue their history and success of integrated wireless power technology as seen in previous Galaxy smartphones. Today, IDT’s wireless power technology expands to provide higher performance and richer features including fast charging and lower power capabilities.

“Samsung has consistently proved themselves as a leading-edge smartphone technology provider. They have truly been an early adopter and champion of wireless power in smartphone and wearable markets,” said Chris Stephens, General Manager of IDT’s Mobile Power and Sensing Division. “We are honored to continue our long-standing technology partnership with Samsung providing consumers with the industry’s best user experience for smartphone charging based on the robust Qi standard”.

IDT’s wireless power receiver offers next-g eneration, highly-integrated, single-chip wireless power WPC and PMA operation modes and integrates Samsung Pay Magnetic Secure Transmission (MST) capability. It is based on an industry-leading, 32-bit ARM M0 Processor that provides a high level of programmability while consuming extremely low standby power.

In addition to providing wireless power technology to global leaders, IDT has introduced wireless power kits in the range 1-15W that enable electronics companies of any size to easily integrate wireless charging transmitter and receiver capabilities into their product designs.

To get more information about IDT’s industry-leading wireless power products, visit http://www.idt.com/go/wirelesspower or contact your local IDT sales representative.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and SmartSensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

© 2017, Integrated Device Technology, Inc. IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc., and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

IDT to Demonstrate Highest Density 4K 10-bit Encoding Solution at IBC 2017

San Jose, California, September 7, 2017 /– Integrated Device Technology, Inc. (IDT) (NASDAQ:IDTI) today announced the latest version of its R22 HEVC 10-bit software encoder. Offering high video quality, high density and low operating expense (OPEX), IDT’s proprietary technology runs on the power-efficient Intel Xeon Processor E3 v5 family with integrated Intel® Iris™ Pro graphics, to provide real-time, software-based video encoding of HEVC 10-bit HDR up to 4Kp60.

“To meet the technical challenges brought on by today’s new content creation, delivery, and distribution models, media and entertainment firms find themselves virtualizing nearly every function and service within their network. These virtualized video workloads can reduce time to market, cost of ownership, and delivery risk, while unlocking new revenue opportunities powered by analytics and service orchestration (automated service delivery). Hewlett Packard Enterprise provides the right technology to enable hybrid cloud infrastructure, empower the intelligent edge, and leverage services and solutions from best of breed partners, like IDT, to simplify the transformation of our customers’ video services delivery,” said Dan Lakey, Media and Entertainment Domain Executive, Hewlett Packard Enterprise.

“We are excited to be highlighting our latest software-based encoding solution at the upcoming IBC show in Amsterdam in partnership with Intel and HPE,” said David Ko, Sr. Product Marketing Manager of Video Products at IDT, Inc. “The industry-leading density of our latest software encoding solution, in combination with our own HEVC algorithm, allows video service providers to deliver the broadcast-quality video that they need to remain competitive in a rapidly changing environment.”

Utilizing Intel Xeon E3 processor, IDT’s latest HEVC compression solution addresses many of the problems operators and vendors face when trying to support HEVC. With high algorithmic complexity, HEVC requires high processing power for encoding or transcoding, increasing both the cost of equipment capable of supporting this technology, as well as the cost of deployment and operation compared to previous compression technologies due to higher power and space requirements. The advanced Intel Xeon E3 technology, in combination with IDT’s own proprietary HEVC algorithm, addresses these issues through lower power consumption and lower cost. IDT’s algorithm takes advantage of GPU optimization to offer the highest video quality.

To see a demonstration of IDT’s latest HEVC Intel Xeon E3 implementation, in partnership with Hewlett Packard Enterprise (HPE), please visit Intel’s stand B65 in Hall 5 at IBC 2017, September 14-18 in Amsterdam. To schedule a meeting with IDT executives at the show, please contact Ian.Jefferson@idt.com.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power and smart sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, and YouTube.

(C) 2017, Integrated Device Technology, Inc. IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc., and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners

IDT Announces Microwave and Millimeter Wave Products, Accelerating Growth in Active Antenna Systems

Dresden, Germany, September 20, 2017 /– DRESDEN, GERMANY Integrated Device Technology, Inc. (IDT®) (NASDAQ:IDTI) today announced that it is sampling a portfolio of millimeter wave beamformer products for 5G next generation communications systems. These products accelerate IDT’s growth in the RF market and consolidate its position as a leading supplier of RF and millimeter wave (mmWave) products for wireless infrastructure.

The products are based on the extensive research and development done on phased array systems by Professor Gabriel Rebeiz, Ph.D., professor at the University of California San Diego, and his team. The unique quad core-chip architecture enables low power consumption solutions that combine low noise, high output power and high resolution amplitude and phase control for the front-end functions of the array.

“These exciting new products highlight IDT’s on-going investment in core technologies to support our customers and grow our existing RF business,” said Duncan Pilgrim, general manager of IDT’s RF division. “IDT is now able to provide customers with products in the key 5G frequency bands of 26, 28 and 39GHz.”

“The commercialization of silicon-based phased array antennas has been a focus of mine for many years and the design team has been able to develop high performance microwave and millimeter wave solutions to enable this,” said Professor Gabriel Rebeiz. “I am happy to help enable IDT provide state-of-the art products to customers and speed up the roll out of phased array solutions across several markets, including 5G millimeter wave.”

Features of the mmWave beamforming ICs that enable high performance antenna arrays are:

  • 4 RF antenna ports, 1 RF common
  • On-chip Wilkinson combiners
  • Internal temperature monitoring
  • 6-bit chip ID
  • Fast SPI module including registers for each channel to control phase and gain biases
  • Hard-wired fast T/R switching
  • 5-bit DAC outputs to drive an (optional) external LNA or PA

The first two parts in the family are the F5280 (25-31 GHz) and F5390 (37-41GHz) transmitter/receiver (half duplex) products. Sample parts and evaluation kits are available to customers on request.

IDT will be exhibiting at the IEEE 5G Summit in Dresden, Germany on Tuesday, September 19. Please stop by the Exhibition Hall, Table 12, in the International Congress Center Dresden and speak to Alastair Upton, Sr. Director of RF Product Marketing about the mmWave core-chips. Also on display will be IDT’s RapidWave™ baseband modem for mmWave wireless backhaul and fixed wireless access.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and smart sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube.

© 2017, Integrated Device Technology, Inc. IDT and the IDT logo and RapidWave are trademarks or registered trademarks of Integrated Device Technology, Inc., and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

www.IDT.com

IDT’s Technical Leaders to Present and Showcase Latest mmWave Solutions at IEEE 5G Summit Dresden

San Jose, California, August 24, 2017 /– Integrated Device Technology, Inc. (IDT) (NASDAQ:IDTI) announced today it will be speaking and showcasing its latest mmWave solutions at the IEEE 5G Summit Dresden. The event occurs September 19th at the International Congress Center in Dresden, Germany. IDT is a proud Gold Sponsor of the event.

IDT will deliver two presentations at the event. The first is titled “5G Vision with Multi-gigabit Wireless Communications at the Network Edge,” and will be delivered by Mohammad Akhter, technical director of IDT’s mmWave engineering group. The second presentation is titled “Autonomous Driving and the 5G Connected Car,” and will be delivered by Christian Wolf, vice president of engineering for IDT’s Automotive & Industrial Group. Specific locations and times will be made available at the event.

In addition, IDT will demonstrate its RapidWave™ RWM6050 mmWave baseband wireless modem solution for fixed wireless access, WTTx (Wireless To The Edge), small-cell backhaul, 5G service, video security networking, and other emerging applications. IDT® RapidWave products use the large mmWave spectrum to deliver wireless multi-gigabit data rates, and provide cost-effective and power-efficient designs to enable commercially viable 5G solutions.

“As a long-standing industry leader in solutions for the 4G+ ecosystem and previous generations of wireless infrastructure, IDT is excited to share its vision and latest technologies supporting the 5G ecosystem,” said Sean Fan, senior vice president and general manager of IDT’s Computing and Communications Group. “We encourage potential customers and partners to attend our presentations and see our mmWave product demonstration. IDT will continue to develop key enabling technologies to address the bandwidth needs of next generation infrastructure. “

Attendees who would like to request a meeting with an IDT representative should complete this form. For more information about IDT’s Millimeter and Microwave solutions, visit www.IDT.com/mmWave.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and smart sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, and YouTube.

© 2017, Integrated Device Technology, Inc. IDT, the IDT logo, and RapidWave are trademarks or registered trademarks of Integrated Device Technology, Inc., and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

IDT’s Newest Clock Generator is up to 60% More Energy Efficient than other Comparable Solutions

San Jose, California, August 16, 2017 /– Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today introduced two new versions of its low-power VersaClock® 3S programmable clock generators. The IDT® 5L35023 and 5L35021 devices provide innovative power-saving features from a single-rail 1.8V power supply while eliminating the need for multiple discrete timing components, and reduce board footprint while saving up to 60% in power consumption versus comparable solutions. Like their predecessors, the new VersaClock® 3S devices meet the performance requirements of widely used standards including PCI Express® Gen 1/2/3. These new devices are ideal for computing systems, digital cameras, IP set-top boxes, home entertainment, audio systems, multi-function printers, IoT gateways, small-business storage, smart devices, medical equipment and automotive infotainment.

“The new VersaClock 3S devices are perfect for customers requiring a single 1.8V power rail to help meet the constraints of today’s low-power compact devices,” said Kris Rausch, vice president and general manager of IDT’s Timing Products Division. “The new chips deliver performance, flexibility and power savings so design teams can hit their performance and power targets using minimal board space.”

Features that enable this optimal combination of performance, power and flexibility include:

  • Proactive Power Saving-intelligently monitors the power down status of the downstream clocked component, automatically switching between normal operation (5-10mA) and suspend mode (less than 2uA 32.768KHz clock only). This results in energy savings with less design effort.
  • Performance Power Balancing – Three individual programmable PLL designs provide a balance between performance and power consumption. This eases system design trade-offs between jitter requirement and power. The device can operate within single-digit mA low power operation or support high-performance requirements such as PCIe gen 3 with additional power.
  • Dynamic Frequency Control (DFC)-Supported by one-time programmable (OTP) memory, this feature provides the ability to dynamically switch between up to four pre-programmed frequencies, satisfying different operating modes or for use across multiple designs without electrical re-designs.

Available now, the seven-output 5L35023 comes in a 4 x 4 mm QFN package and the five-output 5L35021 comes in a 3 x 3 mm QFN package, both supporting CMOS and LP-HCSL outputs. To accelerate application developments, IDT offers the DEV5L35021 and DEV5L35023development kits to support configuration, verification, and programming of devices all in one kit. To learn more information about these VersaClock®3S programmable clock generators, visit www.IDT.com/5L35023 or www.IDT.com/5L35021.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and smart sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, and YouTube.

© 2017, Integrated Device Technology, Inc. IDT, VersaClock, and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc, and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

To view the photo associated with this press release, please visit the following link: http://media3.marketwire.com/docs/VersaClock.jpg

IDT Expands Sensor Portfolio with Solid-State Flow Sensor Modules for Liquids and Gases

San Jose, California, July 27, 2017 /– Integrated Device Technology, Inc. (IDT®) (NASDAQ:IDTI) announced the addition of MEMS-based flow sensor modules to its growing portfolio of industry-leading sensor products. The innovative solid-state sensor element design eliminates cavities and diaphragms typically found in competitive offerings, and features a protective silicon-carbide coating, making it the industry’s most robust and reliable flow sensor element also compatible with food-grade applications.

The IDT® FS1012 and FS2012 are high-performance, digital flow rate sensor modules suitable for both liquids and gases. The sensors have no moving parts, no fragile diaphragm over a cavity, and feature a layer of silicon-carbide coating. This eliminates clogged sensor elements and fluid pressure sensitivity, provides excellent shock resistance, and prevents chemicals from damaging the sensor element – problems inherent to other, common sensor architectures. The attention to these issues make IDT’s solution especially desirable for use in medical, industrial, and FDA-compatible food-grade consumer applications where reliability, robustness, and cross-contamination are critical factors.

“IDT’s portfolio of industry-leading sensor solutions is growing rapidly,” said Sailesh Chittipeddi, executive vice president global operations and chief technology officer at IDT. “The introduction of flow sensor modules provides new opportunities for IDT in medical, industrial, and consumer applications – where its signal conditioning and timing products have built a large customer base and strong reputation over the years. Early engagements with customers have garnered tremendous interest and praise for the challenging problems these digital flow sensors are able to solve.”

The flow sensor modules offer accuracy down to 2% of the measurement reading, providing high-accuracy in high- or low-flow situations using the same sensor module. The compact package, wide -40 to 125°C operating temperature range, and ubiquitous 3V to 5V supply voltage range eases system design integration constraints. Application examples include beverage dispensers, IV drip monitors, oxygen monitors, mass air flow sensors, and gas flow monitors in process equipment.

The FS1012 is an uncalibrated stand-alone flow sensor module with an analog output. The FS2012 is a fully-calibrated version of the same flow sensor, featuring on-board analog to digital conversion and temperature compensation circuitry for plug-and-play usage in complex digital systems.

The FS1012 and FS2012 flow sensor modules are available now. Visit www.IDT.com/flow to learn more and request samples. For more information about IDT’s industry-leading portfolio of sensor products, visit the sensor products webpage or contact your local IDT sales representative.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and smart sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

© 2017, Integrated Device Technology, Inc. IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc., and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.